Solar panel machines

  • Perovskite PV Leaser Machine
  • Perovskite PV Leaser Machine
  • Perovskite PV Leaser Machine
  • Perovskite PV Leaser Machine
Perovskite PV Leaser Machine Perovskite PV Leaser Machine Perovskite PV Leaser Machine Perovskite PV Leaser Machine

Perovskite PV Leaser Machine

Laser scribing is an essential key process in perovskite solar cell manufacturing. It requires completing four core processes: P1 (segmenting the bottom TCO substrate), P2 (scribing the functional layer to expose the TCO substrate), P3 (segmenting the top electrode), and P4 (edge cleaning before encapsulation). By dividing the entire cell into series-connected sub-cells, it achieves improved cell efficiency, with extremely high requirements for processing precision and efficiency. This laser scribing machine adopts ultrafast laser cold processing technology, perfectly matching the high hardness and high brittleness processing characteristics of perovskite materials.

Adopting high-energy-density laser beams, it realizes the full-process scribing for P1 (front electrode division), P2 (intermediate layer processing), P3 (back electrode division), and P4 (edge cleaning) in perovskite solar cell production. Through precise scribing, it achieves series division of sub-cells and edge insulation treatment, ensuring the electrical performance and stability of the cell module.

The equipment adopts a dual optical path design with nanosecond infrared and picosecond green light for perovskite solar cell laser etching processing. It is an integrated machine for P1/P2/P3/P4 layers: P1 layer (TCO layer) uses nanosecond infrared laser etching; P2/P3 use picosecond green light laser etching; P4 uses nanosecond infrared laser etching for edge cleaning.

Ultra-High Scribing PrecisionEquipped with high-precision galvanometer and optical focusing system, scribing width as small as 20μm, positioning accuracy ±5μm, effectively avoiding damage to underlying layers and reducing carrier recombination losses.

Low Heat-Affected Zone: Optimized laser power and scanning speed matching algorithm; material locally evaporates instantaneously during scribing, minimal heat-affected zone, ensuring integrity of cell functional layer structure.

High-Efficiency Integration: Supports multi-channel synchronous scribing, adjustable scribing speed to match production line takt time; flexible adjustment of scribing patterns and spacing, optimizing cell layout and increasing module power density.

Comprehensive Safety Protection: Equipped with closed-loop cooling and efficient dust extraction systems, real-time temperature control, timely removal of scribing fumes and debris, ensuring stable operation and clean working environment.

Ultimate Processing Precision: Integrated multi-beam splitting system with picosecond green laser module, scribing accuracy ≤±10μm, achieving dead zone control below 130μm, effectively reducing inactive area and improving cell power generation efficiency; non-contact processing with minimal heat-affected zone, avoiding damage to surrounding materials and ensuring cell performance stability.

Ultra-High Production Efficiency: Dual-core drive design with 24 processing beams, total scribing speed up to 60m/s, 5 times higher efficiency than traditional 8-beam equipment.

Intelligent Precise Positioning: Equipped with high-precision vision positioning system and automatic loading/unloading mechanism; initial workpiece positioning via short-edge + long-edge dual cylinders, vacuum adsorption fixation to prevent thin substrate damage, positioning accuracy ±5μm, ensuring scribing position precision.

Full Process Compatibility: Compatible with substrate sizes from 300*300mm to 1200*600mm, supports scribing for single-junction and tandem technologies; equipped with process parameter database for quick switching, meeting diverse customer production needs.

Core Parameters

Laser Type: Picosecond Green Laser

Scribing Accuracy: ≤±10μm

Maximum Scribing Speed: 60m/s

Compatible Substrate Size: 300*300mm~1200*600mm(可定制)

Uptime:98%

Core Functions

Adopting high-energy-density laser beams, it realizes full-process scribing for P1 (front electrode division), P2 (intermediate layer processing), P3 (back electrode division), and P4 (edge cleaning) in perovskite solar cell production. Through precise scribing, it achieves series division of sub-cells and edge insulation treatment, ensuring electrical performance and stability of the cell module.

 Key Parameters

 

Parameter Items

Technical    Specifications

Scribing   Line Width

20 μm100 μm   (adjustable)

Positioning Accuracy

±5μm

Compatible Substrate Size

Maximum 1200mm × 2400mm

Scribing Speed

0500 mm/s   (adjustable)

Laser Type

Fiber laser / Semiconductor laser (optional)

 

Video :     https://youtu.be/3WjMHk6pqlE


Contact Us

Contact: REOO Tech

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Tel: +8651384105505

E-mail: mike@reoo.net

Add: Chennan industrial park, Rudong, Jiangsu, China 226400

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