Perovskite Cell Laminator

The laminator is a key piece of equipment in the encapsulation process of perovskite solar panels. By precisely controlling parameters such as temperature, pressure, and time, it ensures tight bonding between solar cells and encapsulation materials, forming sealed, weather-resistant, and impact-resistant module structures that directly determine long-term reliability and service life. This automatic laminator is optimized for the trends of lightweight and flexible perovskite modules, with a core structural design adapted to diverse encapsulation requirements.

 Key Features

• Pressure-assisted      technology enhances interfacial contact between the perovskite      layer, electrodes, and charge transport layers through precisely      controlled pressure (typically 0–7 MPa), reducing voids and improving      carrier transport efficiency. Applying 7 MPa pressure can increase cell      efficiency from 9.84% to 13.67%; however, pressures exceeding 7 MPa cause      perovskite grain fracture, leading to reduced efficiency.

• Uniform      pressure distribution during lamination is critical to producing      large-area modules free of bubbles and with low breakage rates—especially      essential for flexible substrates.

• An infrared      heating lamp system enables rapid heating with high temperature      uniformity (±1°C), meeting the low-temperature processing requirements of      perovskite materials (operating temperature ≤150°C) and preventing thermal      damage.

• A dual-sided      heating design (top and bottom heating plates) ensures uniform melting      of encapsulation materials (e.g., EVA/POE films), effectively filling      interlayer gaps.

• A high-speed      vacuum pump (e.g., rotary vane pump) rapidly evacuates air and      moisture before lamination (achieving vacuum levels ≤0.1 mbar), preventing      perovskite degradation due to exposure to water and oxygen.

• The      system supports programmable pressure ramping, allowing      optimization for different stages of the lamination process.

• The      laminator must handle ultra-thin multilayer stacks—comprising up to five      layers including glass/EVA/perovskite absorber/electrode/backsheet—with a      total thickness of less than 1 μm, demanding exceptional pressure      uniformity and rapid thermal response.

• A non-stick,      high-temperature fabric conveyor system prevents EVA adhesion to the      heating plates, minimizing contamination and reducing maintenance costs.

Post-encapsulation, the water vapor and oxygen transmission rate must be below 10⁻⁶ g/m²/day. The laminator achieves this by precisely controlling film melting and edge-sealing processes—such as using polyisobutylene (PIB) sealants—to extend module 

Core Advantages：

Uniform Pressure Distribution: Adopts zoned pressure control technology with an adjustable pressure range of 0.1–0.8 MPa. Pressure uniformity deviation is ≤±5%, ensuring tight bonding across all module areas during lamination, preventing defects such as bubbles and wrinkles, and improving sealing performance.

Precise Process Control: Equipped with a high-precision temperature control system with a temperature range from room temperature to 200°C and uniformity of ±2°C. Supports multi-stage temperature-pressure curve programming to accurately match the process requirements of different encapsulation materials (EVA, POE, etc.), ensuring consistent encapsulation quality.

High-Efficiency Automation: Uses servo drive and intelligent positioning systems to realize full-process automation, including automatic loading, alignment, lamination, and unloading. Production takt time can be optimized according to customer capacity requirements, supporting continuous mass production.

Wide Compatibility: Supports encapsulation of both rigid glass substrates and flexible PET/CPI substrates. Compatible with module sizes ranging from 300 × 300 mm to 2.88 m², with flexible customization according to customer product specifications.

Core Parameters：

• Pressure      Range:0.1~0.8MPa
• Temperature      Range: Room temperature to 200°C
• Temperature      Uniformity: ±2℃
• Compatible      Module Size: 300 × 300 mm to 2.88 m² (customizable)
• Control      System: PLC + Touchscreen intelligent control, supporting process      parameter traceability.

Key Parameters