Laser cutting machine

Please watch the video on Youtube:

https://youtu.be/4H069kZQk9A

Main purpose of equipment: mono crystal line and poly crystal line silicon solar cell dicing process.

1. Main technical specification

High speed, 1600 / h

Loading : Whole cell box , 100pcs.

Unloading: Whole cell box.

Not pollute on solar cell.

Can cut solar cell : G6, 166 X166, M10 , 180 X 180， M12, 210 X 210, mm 。

Power of laser: 30W. 10% to 100% variable.

Laser wave lenth: 1064nm

Dicing speed : Maximum: 600mm/s

Deepness: 1/2 - 1/3 cell.

Precision : +/- 0.05mm

Frequency : 20 - 80KHZ variable.

Air pressure: 0.6 - 0.8 Mpa. 400L/min

Power: 220V/50Hz, 2 KW

Measurement: 1250 x 1100 x 1380mm

Net Weight: 300Kg.

2. Complete machine configuration

2.1 Laser: Domestic fiber laser (air-cooled)

2.2 Power control cabinet

2.2.1  Laser power supply

2.2.2  Main power supply and protection system

2.2.3  Table drive system

2.2.4  Computers and monitors (IPC chassis)

2.2.5  Special control software ( English Version ).

2.3  Work table

2.3.1  Servo motor drive

2.3.2  Ball screw / linear guide / Couplings

2.3.3  Vacuum adsorption system (foot control) (automatic adsorption).

2.3.4  Dust extraction system.